open access publication

Article, 2024

Water nanofilm boiling on a copper surface in the presence of dissolved air

Applied Thermal Engineering, ISSN 1359-4311, 1873-5606, Volume 244, Page 122697, 10.1016/j.applthermaleng.2024.122697

Contributors

Situ, Wenfu 0000-0002-9280-633X [1] Zambrano, Harvey A 0000-0003-1049-8482 [2] Walther, Jens Honore 0000-0001-8100-9178 (Corresponding author) [1]

Affiliations

  1. [1] Technical University of Denmark
    2. [NORA names: DTU Technical University of Denmark; University; Denmark; Europe, EU; Nordic; OECD];
  2. [2] Federico Santa María Technical University
    3. [NORA names: Chile; America, South; OECD]

Abstract

Boiling is an effective and critical energy transfer process in energy, aerospace, and electronic applications. With the rapid development of nanotechnologies, the development of a highly efficient thermal management system for high flux energy applications from microscale to nanoscale becomes a promising topic. The dissolved air in water nanofilms has adverse influence on the boiling process due to the size effects, but the boiling mechanism at the nanoscale has not been well clarified. Therefore, non-equilibrium molecular dynamics (NEMD) simulations are employed to investigate the behavior of water boiling on a nanoscale copper surface in the presence of air. We observe that the interfacial air layer adsorbed on the copper surface increases the boiling time by 73, 20, and 7 times at a pressure of 1 bar , 20 bar , and 100 bar , respectively. We propose a theoretical model based on the heat conduction differential equation to predict the time evolution of water temperature at atmospheric pressure. The results indicate that the boiling process at the nanoscale only manifests into Leidenfrost phenomenon rather than bubble nucleation, along with the negative effects of air dissolved in water nanofilm. By revealing the boiling process on a copper surface at the nanoscale, this work provides useful insights for broad applications in nanoscale thermal management and energy conversion.

Keywords

Leidenfrost, Leidenfrost phenomenon, adverse influence, aerospace, air, air layer, applications, atmospheric pressure, bar, behavior, behavior of water, boiling, boiling mechanism, boiling process, boiling time, bubble, bubble nucleation, conversion, copper, copper surface, development, development of nanotechnology, differential equations, dissolved air, dynamics, effect, effect of air, efficient thermal management system, electronic applications, energy, energy applications, energy conversion, energy transfer process, equations, evolution of water temperature, flux, heat, heat conduction differential equation, influence, layer, management, management system, mechanism, microscale, model, molecular dynamics, nanofilms, nanoscale, nanoscale thermal management, nanotechnology, negative effects, non-equilibrium molecular dynamics, nucleation, phenomenon, presence, presence of air, presence of dissolved air, pressure, process, results, simulation, size, size effect, surface, system, temperature, theoretical model, thermal management, thermal management system, time, time evolution, transfer process, water, water nanofilm, water temperature

Funders

  • China Scholarship Council

Data Provider: Digital Science

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