Article,
The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
Contributors
Wang, Zeping
0000-0002-2461-4010
(Corresponding author)
[1]
Zheng, Kai
0000-0003-3168-6909
[1]
[2]
Yu, Jiabing
0000-0001-7206-6592
[1]
Chen, Xianping
0000-0002-6332-0955
(Corresponding author)
[1]
Affiliations
- [1] Chongqing University [NORA names: China; Asia, East];
- [2] Technical University of Denmark [NORA names: DTU Technical University of Denmark; University; Denmark; Europe, EU; Nordic; OECD]
Abstract
Highly conductive and robust Cu-Cu jonts are achieved by the low temperature sintering of Cu nanoparticles (Cu NPs) with a formic acid treatment. When sintered at 300 °C, the Cu-Cu joints exhibited a low resistivity of 4.79 µΩ·cm with a shear strength larger than 30 MPa. In addition, unique oxidation-enhancing effect of Cu-Cu joints is discovered in thermal storage experiments. When thermal storage at 50 h, the strength of the joints increases to 39.25 MPa, while the resistivity is only increased by a factor of 5.78. This discovery provides a potential packaging enhancement process for practical application of electronic devices.
Keywords
Cu NPs,
Cu nanoparticles,
Cu-Cu,
Cu-Cu joints,
NPs,
acid treatment,
applications,
applications of electronic devices,
copper,
copper formate layer,
devices,
discovery,
effect,
electronic devices,
enhancement,
enhancement process,
experiments,
factors,
formation,
formation layers,
formic acid treatment,
joints,
jont,
layer,
low resistivity,
low-temperature sintering,
nanoparticles,
oxidation,
oxidation enhancement,
process,
resistance,
shear,
shear strength,
sintering of Cu nanoparticles,
storage,
storage experiments,
strength,
thermal storage,
thermal storage experiment,
treatment
