Article,
CuxS/PAN 3D Nanofiber Mats as Ultra‐Lightweight and Flexible Electromagnetic Interference Shielding Materials
Affiliations
- [1] Tianjin Polytechnic University [NORA names: China; Asia, East];
- [2] Aalborg University [NORA names: AAU Aalborg University; University; Denmark; Europe, EU; Nordic; OECD]
Abstract
Abstract Shielding materials are becoming increasingly important, but present materials suffer from either insufficient mechanical stability or limited shielding properties. In this study, 3D flexible copper sulfide (Cu x S)/polyacrylonitrile (PAN) nanofiber mats are developed via air spinning followed by chemical reaction with copper salt. The Cu x S/PAN nanofiber mats exhibit an ultra‐lightweight density of 0.044 g cm −3 and a thickness of 0.423 mm. Stable electromagnetic interference (EMI) shielding effectiveness (SE) (29–31 dB) of the Cu x S/PAN composite is achieved in the frequency range of 500–3000 MHz. EMI SE per unit surface density of 16 655.92 dB cm 2 g −1 is several orders of magnitude higher than most copper sulfide containing EMI shielding materials reported in literature. In addition, the introduction of the Cu x S improves the thermal stability and launderability of the PAN mats giving the mats thermal, mechanical, and aqueous stability. Finally, the shielding mechanism of the Cu x S/PAN nanofiber mats for electromagnetic waves is proposed