COLD PLATE ASSEMBLY FOR LIQUID COOLING OF ELECTRONIC DEVICES

A cold plate assembly for use in a liquid cooling system for cooling of a computing device having a plurality of active regions from which heat is dispersed with varying intensity ranging from one or more high-intensity zones to one or more low-intensity zones. The cold plate assembly has a cold plate for exchanging heat between said computing device and cooling liquid and a distribution layer configured to be mounted onto the cold plate. The cold plate comprises guiding means for guiding cooling liquid from an inlet channel to an outlet channel along an inner surface of the cold plate in a predefined pattern focusing the liquid flow across one or more predefined high-priority zones. The inlet channel is arranged such that it is at least partially coinciding with a high-intensity zone of the computing device when the cold plate assembly is arranged to cool the computing device. The cold plate of the cold plate assembly may be 3D printed which allows for flexible cold plate designs which may be obtained by a method of iterative optimisation.