Patent-family-85018496

Electronic device and method of monitoring an adhesive layer is disclosed, the method comprising obtaining sensor data comprising first sensor data from a first electrode pair associated with the adhesive layer; determining, based on the sensor data, a first parameter indicative of a first electrical property of the adhesive layer; determining, based on the sensor data, a second parameter indicative of a second electrical property of the adhesive layer; determining, based on the first parameter and the second parameter, an operating state of the adhesive layer; and outputting the operating state via an interface.