Patent-family-84829915

The present disclosure relates to a stencil mask for defining a plurality of patterns on a substrate during evaporation of material from an evaporation source, the stencil mask comprising a membrane having a top surface and bottom surface and a thickness therebetween of at least 200 nm defining the thickness of the membrane, and a at least one set of parallel slits extending through the thickness of the membrane, wherein the slits are defined such that the material coming from an evaporation source is blocked by the mask or deposited onto the substrate depending on the alignment of said source with the stencil mask.